Abstract: Advanced packaging suppliers are having two primary challenges during IC substrate fabrication, meeting the requirements on copper plating performance and reducing the cost from ...

Avoiding via failures caused by barrel plating separation. PCB manufacturers face challenges in the precise registration of multiple layers, which is required to ensure reliable interconnects, and in ...

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

There are some hidden dangers in electrolytic copper foil, such as capacity reduction, battery thermal runaway and so on. In the lithium battery industry, the mainstream negative current collector is ...

Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...